Title: Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments When: Tuesday, March 27, 2007 at 10:00 AM Where: MARC Building, Room 331
Event Subject
Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments
Event Speaker
Andrew Perkins
Event Location
MARC Building, Room 331
Event Date