Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Method When: Tuesday, July 15, 2008 at 3:00 PM Where: MARC Building, Room 331
Event Subject
Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Method
Event Speaker
Jin Yang
Event Location
MARC Building, Room 331
Event Date