Title: STUDY OF Sn-Ag-Cu ALLOY RELIABILITY THROUGH MATERIAL MICROSTRUCTURE EVOLUTION AND LASER MOIRE INTERFEROMETRY When: Monday, June 30, 2008 at 2:00 PM Where: MARC Building, Room 201

Event Subject
STUDY OF Sn-Ag-Cu ALLOY RELIABILITY THROUGH MATERIAL MICROSTRUCTURE EVOLUTION AND LASER MOIRE INTERFEROMETRY
Event Speaker
Krishna Tunga
Event Location
MARC Building, Room 201
Event Date