Title: Development of Microelectronics Solder Joint Inspection System: Modal Analysis, Finite Element Modeling, and Ultrasound Signal Processing When: Friday, May 12, 2006 at 1:00 PM Where: MARC Building, Room 401
Event Subject
Development of Microelectronics Solder Joint Inspection System: Modal Analysis, Finite Element Modeling, and Ultrasound Signal Processing
Event Speaker
Lizheng Zhang
Event Location
MARC Building, Room 401
Event Date