Title: Development of Convective Reflow-Projection Moire Warpage Measurement System and Prediction of Solder Bump Reliability on Board Assemblies Affected by Warpage When: Monday, February 18, 2008 at 2:00 PM Where: MARC Building, Room 401
Event Subject
Development of Convective Reflow-Projection Moire Warpage Measurement System and Prediction of Solder Bump Reliability on Board Assemblies Affected by Warpage
Event Speaker
Wei Tan
Event Location
MARC Building, Room 401
Event Date