Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods When: Thursday, January 24, 2008 at 9:30 AM Where: MARC Building, Room 401
Event Subject
Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods
Event Speaker
Jin Yang
Event Location
MARC Building, Room 401
Event Date