Title: Electroplated Multi-Path Compliant Copper Interconnects for Flip-Chip Packages When: Monday, December 17, 2012 at 1:00 PM Where: MARC Building, Room 401
Event Subject
Electroplated Multi-Path Compliant Copper Interconnects for Flip-Chip Packages
Event Speaker
Raphael Okereke
Event Location
MARC Building, Room 401
Event Date