Title: Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages When: Friday, December 14, 2012 at 2:00 PM Where: MARC Building, Room 201
Event Subject
Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages
Event Speaker
Xi Liu
Event Location
MARC Building, Room 201
Event Date