Microelectronics and Emerging Technologies Thermal Lab (METTL)
 

 


Education

  • Ph.D., University of Pennsylvania, 1984
  • M.S., State University of New York, Buffalo, 1981
  • B. Tech., Indian Institute of Technology, Kanpur, 1979

Teaching Interests

Professor Joshi's teaching interests encompass core mechanical engineering subjects at both undergraduate and graduate levels. These include materials behavior, thermodynamics, and micro/nanoscale materials science. He emphasizes foundational understanding and practical application, aiming to equip students with the skills to analyze and solve complex engineering problems related to materials and manufacturing processes.

Research Interests

Professor Joshi's research focuses on understanding the microstructural behavior of materials under various conditions to inform the design of advanced materials and manufacturing techniques. His work integrates experimental and theoretical approaches to study deformation, damage, and reliability of heterogeneous materials, including composites and nanostructured systems, with the goal of improving performance and durability.

Recent Publications

  • AM Muslu, Y Joshi, Unlocking the Potential of Integrated Cooling and Power Delivery in Multi-chip Power Electronics Packages with Triply Periodic Minimal Surfaces (TPMS), International Journal of Heat and Mass Transfer 255, 127866, 2026
  • Y Joshi, S Graham, S Kumar, Device-and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report), National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV …, 2025
  • YK Joshi, AH Smith, RC Eden, SK De, Three Decades of Thermal Management Research at DARPA, Journal of Electronic Packaging 147 (3), 030802, 2025
  • M Belinson, JM Brown, Y Joshi, Modelling Transient Pressure and Temperature Signatures in Gasketed Outdoor Digital Displays, International Electronic Packaging Technical Conference and Exhibition 89299 …, 2025
  • U Kemerli, G Moreno, R Chaudhary, S Narumanchi, Y Joshi, Thermal Performance of Triply Periodic Minimal Surface Lattice Structures in Single-Phase Dielectric Fluid Cooling of Power Electronics, ASME Journal of Heat and Mass Transfer 147 (11), 111501, 2025