Title: Rapid Prototyping of Microsystems Packaging by Data-Driven Chip-First Approach using Nano-particle Silver Interconnects When: Tuesday, January 22, 2008 at 10:15 AM Where: MARC Building, Room 431

Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods When: Thursday, January 24, 2008 at 9:30 AM Where: MARC Building, Room 401

Title: In-Process Sensing of Weld Penetration Depth Using Non-Contact Laser Ultrasound System When: Thursday, January 31, 2008 at 3:00 PM Where: MARC Building, Room 401

Title: An Experimental and Theoretical Investigation of a Fuel System Tuner for the Suppression of Combustion Driven Oscillations When: Tuesday, February 5, 2008 at 3:00 PM Where: Knight Bldg, Room 317

Title: Fundamental Study of Void Formation for Application of Flip Chip Package Assembly Process When: Wednesday, February 6, 2008 at 10:00 AM Where: MARC Building, Room 431

Title: Development of Thin Film Interfacial Fracture Testing Technique using an Intrinsically Stressed Electroplated Metal Layer When: Wednesday, March 5, 2008 at 1:00 PM Where: MARC Building, Room 201

Title: Energy Efficient Thermal Management of Data Centers Via Open Multi-Scale Design When: Friday, March 7, 2008 at 1:00 PM Where: MARC Building, Room 114

Title: Scanning Micro Interferometer Arrays with Tunable Diffraction Gratings for Parallel Operation When: Thursday, March 13, 2008 at 3:00 PM Where: Love Building, Room 210

Title: Dynamics of Turbulent Swirling Flows Induced by Twisted Tapes in Circular Pipes When: Wednesday, April 2, 2008 at 10:00 AM Where: IPST Building, Room 521

Title: Micromachined Diffraction Based Optical Microphones and Intensity Probes with Electrostatic Force Feedback When: Thursday, April 24, 2008 at 9:00 AM Where: Love Building, Room 210